Electronics Forum | Thu Jul 08 00:19:15 EDT 2010 | bubbobbed
thank you very much...i'll try this up...
Used SMT Equipment | Soldering - Reflow
4 zones, Left to Right operation, Mesh belt type rail, Ceter board support. Nitrogen inerting
Used SMT Equipment | Soldering - Reflow
Energy Tech Systems Curing/Reflow Oven. Model 4814. Very Good Condition. 208V, 3 Phase, 60 Amps. IR, Edge chain rail. 4 heating zones one cooling zone. 2 inch clearance for curing assemblies with tall components. PCB width adjustment and speed adju
Industry News | 2010-07-08 12:45:56.0
Working together to address the latest round of proposed substance restrictions, IPC and the Indian Printed Circuits Association (IPCA) have submitted comments in response to the Indian Government’s Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.
Industry News | 2010-07-08 13:05:54.0
Christopher Associates announces that Koh Young’s KY8030-3 has established its credentials as the best and most cost-effective solder paste inspection system in the North American market with several key “wins” in the past 90 days with small, mid-sized and large manufacturers in several market sectors.
Parts & Supplies | Pick and Place/Feeders
feeders are in stock for sales.
Parts & Supplies | Screen Printers
we are looking for blades and also complete squegees in PERMAFLEX for the sizes 190 230 270 310 330 380 . thank you
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Technical Library | 2010-07-08 19:56:15.0
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.
| http://etasmt.com/te_news_bulletin/2019-08-07/9361.chtml
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