New SMT Equipment: 2020 20.25 (237)

Dry Cabinet Series 435

Dry Cabinet Series 435

New Equipment | Other

A full range of various dry storage cabinets ensures that your production is based on the IPC/JEDEC Standard STD-033B for moisture sensitive devices.

1 CLICK SMT TECHNOLOGY CO., Limited

Lowering Gate Conveyor Series

Lowering Gate Conveyor Series

New Equipment | Board Handling - Conveyors

This unit is used when a passage way is required in a production line.

1 CLICK SMT TECHNOLOGY CO., Limited

Electronics Forum: 2020 20.25 (1)

bought Quad QSA30, need manual

Electronics Forum | Tue Jul 21 20:25:56 EDT 2020 | eptac

You may contact PPM in Fremont, NH. They sell and service Quad equipment.

Used SMT Equipment: 2020 20.25 (1)

Test Research (TRI) TR7500

Test Research (TRI) TR7500

Used SMT Equipment | AOI / Automated Optical Inspection

TR7500 Automated Optical Inspection(AOI) System M.Date: 2008/07 Optical/Imaging System: 1 Top View Camera XGA 3CCD color camera (1024 x 768) 4 Angled View Cameras XGA mono camera (1024 x 768) Lighting Multi-segment, multi-angle LED, RGB+W Optic

World Equipment Source, LLC

Parts & Supplies: 2020 20.25 (7)

Fuji CNSMT GGEH2233 Harness FUJI XPF Accessories

Fuji CNSMT GGEH2233 Harness FUJI XPF Accessories

Parts & Supplies | Assembly Accessories

CNSMT GGEH2233 Harness FUJI XPF Accessories CNSMT GGEH2233 Harness FUJI XPF Accessories Mounter parts FUJI Mounter parts pressure cover buckle Feeder pressure cover buckle Mounter parts FUJICP6HOLDER disassembly parts of good quality Mounter

CNSMT CO.LTD

Fuji CNSMT [S4040Y] EE-SPX405-W2A CP643 photoelectric sensor FUJI

Fuji CNSMT [S4040Y] EE-SPX405-W2A CP643 photoelectric sensor FUJI

Parts & Supplies | Assembly Accessories

CNSMT [S4040Y] EE-SPX405-W2A CP643 photoelectric sensor FUJI CNSMT [S4040Y] EE-SPX405-W2A CP643 photoelectric sensor FUJI Mounter parts SM 8MM FEEDER solenoid valve V114T-5MOZ disassembly parts Mounter parts, printing machine parts, KEG GKG PC

CNSMT CO.LTD

Technical Library: 2020 20.25 (5)

Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components

Technical Library | 2017-07-20 15:18:15.0

As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.

Kester

Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics

Technical Library | 2020-02-19 23:12:55.0

Silver nanowires (Ag NWs) possess excellent optoelectronic properties, which have led to many technology-focused applications of transparent and flexible electronics. Many of these applications require patterning of Ag NWs into desired shapes, for which mask-based and printing-based techniques have been developed and widely used. However, there are still several limitations associated to these techniques. These limitations, such as complicated patterning procedures, limited patterning area, and compromised optical transparency, hamper the efficient fabrication of high-performance Ag NW patterns. Here, we propose a coat-and-print approach for effectively patterning Ag NWs.

Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab

Express Newsletter: 2020 20.25 (41)

SMTnet Express - April 9, 2020

SMTnet Express, April 9, 2020, Subscribers: 35,627, Companies: 10,989, Users: 25,746 Soft Material-Enabled, Flexible Hybrid Electronics for Medicine, Healthcare, and Human-Machine Interfaces Credits: Washington State Magazine Flexible hybrid

SMTnet Express - January 23, 2020

SMTnet Express, January 23, 2020, Subscribers: 33,753, Companies: 10,965, Users: 25,546 Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies Credits: ALTER TECHNOLOGY Flip chip assembly techniques bring a wide range


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