Industry News | 2018-10-18 10:18:58.0
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
Industry News | 2009-12-07 18:55:54.0
Solothurn, Switzerland - October2009 - JUKI, a world-leading provider of automated assembly products and systems, announces that it will highlight its latest line-up of brand new and tried and tested Chipshooters, Flexible Mounters, Intelligent feeders and Software in Hall A3, Stand 143 of the Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2007-10-23 16:09:16.0
MORRISVILLE, NC - October 23, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the FX-1R High-speed Chip Shooter in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.
Industry News | 2008-04-22 20:41:32.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the FX-1R High-speed Chip Shooter in booth 817 at the upcoming Nepcon East exhibition and conference, scheduled to take place April 30-May 1, 2008 at the Boston Convention & Exhibition Center in Boston.
Industry News | 2008-09-16 12:20:13.0
MORRISVILLE, NC - September 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will exhibit the FX-1RL High-speed Chip Shooter in booth 809 at the upcoming IPC Midwest exhibition and conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.
Industry News | 2009-03-24 12:59:22.0
MORRISVILLE, NC - March 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the FX-1R High-speed Chip Shooter in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2013-04-10 11:48:47.0
Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
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