Stencil Wiping Rolls are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. We manufactur
Electronics Forum | Mon Jul 13 06:02:08 EDT 2015 | piyakorn
Hi All Some our customer has a new order but has been stopped long time ago (2012) which ENIG PCB in our raw material stock that are date code xx12 (still be vacuum sealed with silica gel) so,Will there be any risk or not? Help me please. Than
Electronics Forum | Fri Jul 24 16:33:45 EDT 2015 | cnotebaert
You should be fine! best practice for a situation like this would be to run a solder sample, either flux it and run through wave, or screen print, don't place parts and run through reflow. look for proper wetting characteristics if you see de-wetting
6 Second Cycle Time Triple Track Conveyor System (66" Track Length). With Servo Driven Vision X, Y and Z Axes. This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional for your l
1 PYRAMAX 100 Nitrogen ready 208VAC 1 OPT-1: Rail Only Conveyor (0.190in/4.8mm pin) 1 OPT-15: 5kW Heater Upgrade 1 OPT-30: Closed Loop Convection Control 1 OPT-33: Double Cooler 1 OPT-34-DBL: Recirculating Water 1 OPT-43-C: HE Flux Managem
Industry News | 2015-02-16 16:40:35.0
Based on its recent analysis of the market for electronics manufacturing services (EMS) providers for the aerospace and defence (A&D) industry, Frost & Sullivan recognises Europlacer with the 2015 Global Frost & Sullivan Award for Growth Excellence Leadership.
Industry News | 2012-11-20 17:32:47.0
During the 2012 Annual Meeting at SMTA International, the SMTA announced that Xian Qin, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2012 Charles Hutchins Educational Grant.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2015-12-01 20:36:48.0
On January 1, 2015, nine months from APEX 2014, the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase out will have significant technical, performance, and economic implications for the electronics industry. The regulatory situation remains fluid. A number of alternative solvents have been or are in the process of being developed. We discuss the options for assemblers and component manufacturers.
Career Center | sabarinathan95, India | Engineering,Maintenance,Quality Control,Engineering,Maintenance,Quality Control,Engineering,Maintenance,Quality Control,Engineering,Maintenance,Quality Control
i am sabarinathan ap working in AVALON TECH PVT LTD at chennai as a QUALITY CONTROLLER and also have a knowledge in DEBUGGING and TESTING .i have 1 year experience in quality field.
SMTnet Express, March 26, 2015, Subscribers: 22,542, Members: Companies: 14,271 , Users: 37,963 Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals Michael Osterman; Center for Advanced Life Cycle
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