Technical Library: 20soldering and machine (Page 1 of 9)

Dam and Fill Encapsulation for Microelectronic Packages

Technical Library | 1999-08-27 09:29:49.0

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...

Nordson ASYMTEK

The Industry Requirement for 2D and 3D Inspection Technology in a Single AOI Platform

Technical Library | 2012-11-21 18:57:58.0

The continuing evolution toward advanced miniature packaging has led to ever increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is an ever increasing probability for defects to occur on finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship on electronic assemblies. While advancements in conventional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper component orientation, insufficient solder, and solder bridges; there is an inherent limitation in the ability to inspect for co-planarity of ultra-miniature chips, leaded device, BGA and LED packages.

MIRTEC Corporation

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Technical Library | 2014-10-23 18:10:10.0

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components

KYZEN Corporation

Hand Printing using Nanocoated and other High End Stencil Materials

Technical Library | 2019-05-29 23:10:30.0

There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.

BEST Inc.

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Technical Library | 1999-08-05 10:57:54.0

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity.

SEMATECH

Liquid Tin Corrosion and Lead Free Wave Soldering

Technical Library | 2008-02-12 22:52:41.0

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.

Speedline Technologies, Inc.

SMT Placement for ICs, Connectors and Odd-Shaped Components

Technical Library | 2009-11-18 23:37:52.0

Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link.

Juki Automation Systems

No-Residue Technology Chemistry and Physics

Technical Library | 2004-09-02 11:56:32.0

The main goal of this paper is to highlight the importance of interrelating the physics and the chemistry in wave soldering and soft soldering in general. Often we find the disciplines of chemistry and physics being analyzed distinct and separate. However in the quest for alternative ways for leading edge competitive and especially environmental friendly manufacturing, separating or ignoring this interrelationship is detrimental to the success of No-Residue soldering.

Interflux USA, Inc.

Programmable Logic Controller vs Programmable Automation Controller

Technical Library | 2013-04-03 22:41:18.0

PLC vs PAC Difference & PAC Automation Controller Defined: This PLC vs PAC Difference article defines the PAC automation controller in relationship to the PLC. A PLC vs PAC comparison. Even more importantly, this article explains in great detail the need to differentiate when it comes to requesting and delivering PAC and/or PLC training.

Business Industrial Network

Printed Circuit Board Tracking with RFID: Speed, Efficiency and Productivity Made Simple.

Technical Library | 2008-05-07 17:54:58.0

Tracking goods through manufacturing was originally accomplished with pencil, paper and human input. Barcodes introduced an automated, machine-readable tracking mechanism that streamlined all types of manufacturing. But modern printed circuit board (PCB) assemblies are running into limitations because of barcode labels. And though barcodes and RFID tags will co-exist, the relatively large barcode labels have to find increasingly scarce real estate on high density boards.

Texas Instruments

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