Industry Directory | Manufacturer
Micro Dynamics has been an employee-owned Electronic Manufacturing Services provider since 1981.
Industry Directory | Manufacturer
Flexible circuit manufacturing and assembly. 20 years experience.
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
New Equipment | Selective Soldering
Enhanced, entry-level, single point selective soldering system With all the proven features of the Jade MKII, the Jade MKIV sets even higher standards of performance. Designed to meet the needs of the small/medium batch manufacturer who requires hi
Electronics Forum | Fri Feb 27 07:59:47 EST 2004 | cyber_wolf
Is it true that a DEK printer will not accept a standard 20X20 stencil. I have heard that the image on the stencil is offset as well.(you need special stencils just for DEK printers?) Do they make an adapter to accommodate standard 20X20's with cent
Electronics Forum | Fri Feb 27 12:06:03 EST 2004 | jseagle
A 20 x 20 frame with the image centered will drop in IF you have a printer with adjustable rails for the stencil, the rails move in and out to accomodate 29 x 29 to smaller than 20 x 20. Otherwise, you will need the adapter. James
Used SMT Equipment | Screen Printers
MPM, Screen Printer, type UP 2000/B , s.n. 22256, size Approx 1,17 x 1,60 x 1,50 meters , max plate 20' x20', with CRT monitor and internal PC, CE Marked
Used SMT Equipment | AOI / Automated Optical Inspection
ORBOTECH, Visual inspection machine, type TRION 2340, s.n. 0601265, with 3D edge detection, included DELL PC inside and flat monitor HP, size approx. 1,20x1,25x,1,60 meters, year 2001
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Parts & Supplies | Circuit Board Assembly Products
YAMAHA KHY-M4570-20X BOARD ASSY jenny@ksunsmt.com
Parts & Supplies | Circuit Board Assembly Products
YAMAHA KHY-M4570-20X BOARD ASSY jenny@ksunsmt.com
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
03002801-02 SIPLACE AXIS Testing Complete 03002842-01 Klettostar-Flausch 20x80 03002870-04 PCB / HEAD ADAPTER C+P 20 03002874-01 ADAPTER FOR SAT KSP-A360 03002876-01 SHORT STROKE ZYLINDER 20x10 03002898-02 ENTERING GUIDE FEEDER /X
03002801-02 SIPLACE AXIS Testing Complete 03002842-01 Klettostar-Flausch 20x80 03002870-04 PCB / HEAD ADAPTER C+P 20 03002874-01 ADAPTER FOR SAT KSP-A360 03002876-01 SHORT STROKE ZYLINDER 20x10 03002898-02 ENTERING GUIDE FEEDER /X
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