Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
Contact :Jim(Sales Manager) ❤Mobile(WhatsApp): 86-18020776782 ❤Email: sales6@amikon.cn ❤Skype:live:sapphire_264 ABB SAFT123PAC Promiss 100% full New - Original Factory Seal Warranty: 12 months Package: Original packing with cartons Paymen
Electronics Forum | Fri Dec 17 18:21:43 EST 1999 | Clarissa L. Ortner
We are a small start up. We will be buying a stenciling machine and semi automated pick and place. ( We have the oven) We are presently stenciling without any assit and loading leadless parts only(no fine pitch) by hand. We need to improve thrupu
Electronics Forum | Thu Apr 05 13:01:08 EDT 2007 | mfoster
Hi, The Samsung SM321 XLB can handle 20" x 24"...
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2018-01-04 18:42:36.0
Kurtz Ersa North America will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Monday, Jan. 25, 2018 at the West Club at Mile High Stadium in Denver, CO. The Ersa team will highlight its advanced reflow, selective solder and rework equipment.
Parts & Supplies | Assembly Accessories
Yamaha KSUN 63F nozzle For YV88X Pick and Place Machine More Yamaha CL Feeders & Valves in stock Yamaha Feeders YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8
Parts & Supplies | Pick and Place/Feeders
Yamaha KSUN CL16mm feeder FOR Pick and Place Machine More Yamaha CL Feeders & Valves in stock Yamaha Feeders YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4m
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
VP-2800HP-CL64-4R 4 heads High speed HD USB3 camera aligns 4 heads during fly by Optional 19 slot nozzle changer increase speed can use 4 same nozzle at a time Optional dispenser head 64x 8mm CL Feeder slots in 2 bays 35x 8mm Push feeder on w
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KM0-M655F-20X YAMAHA YV100II In / Out Sensor SEEKA DS4R-50PN KH4-M655F-20X Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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