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Samsung Nozzles available for CP33/Quad30/CP40C/ CP45/CP45NEO/DP20 Samsung Nozzles available for CP33/Quad30/CP40C/ CP45/CP45NEO/DP20 CP-33 and Quad -30 Nozzles Part Number Description XF Nozzle, XF XG Nozzle, XG (1608) XG-M Nozzle, XG-M X
Agilent-Keysight 86103A 2.8 GHz optical / 20 GHz electrical module The Agilent 86103A provides the ideal measurement system for testing SDH/SONET signals operating at 155 or 622 Mb/s or Fibre Channel 1063 Mb/s and Gigabit Ethernet 1250 Mb/s rat
JDSU FST-2802 Acterna Ethernet and Fibre Channel Services Module The FST-2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troubleshooting these variou
Industry News | 2011-02-21 18:38:52.0
ZESTRON will host an IPC J-STD-001 Certified IPC trainer seminar March 21-25, 2011, at its Technical and Analytical Center in Manassas, VA. This comprehensive technical training titled "IPC/EIA/JEDEC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies" will be conducted by Circuit Technology.
" 7WL ASSY (ø1.2 / 0.6)" YAMAHA KV6-M7113 HSD DISPENDING NOZZLE PHILIPS Part Number (OEM) Description Part Number (OEM) Description KV6-M7113-1XX YAMAHA YMH KV6-M7113 HSD DISPENDING NOZZLE PHILIPS 2D/2S ø0.7/ ø0.4 P=0.9 KV6-M7113-2XX YMH KV6-
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2017-11-15 22:49:14.0
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.
Training Courses | | | IPC-7711/IPC-7721 Expert (CSE)
The IPC-7711/IPC-7721 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-7711/IPC-7721 standard.
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