New SMT Equipment: 240-250 (1)

Tachometer Module 3500/50E GE Bently Nevada

Tachometer Module 3500/50E GE Bently Nevada

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1  Mobile(Whatsapp): (+86)-18020776786 ​​​ Yuehang:  Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: 240-250 (2)

Wave Profiling a Ceramic SMT Cap

Electronics Forum | Wed Jan 02 13:31:55 EST 2002 | PeteC

The rule-of-thumb is to follow the flux mfg.'s recommended profile to achieve their specified top side PCB temperature before making contact with the wave. Typical top side PCB temps are 100-120deg.C. Your wave contact time should be around 2 seconds

Re: BGA Warp

Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko

3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se

Industry News: 240-250 (5)

SHENMAO Offers Low-Temperature Lead-Free Solder Paste for Sensitive Components

Industry News | 2022-04-13 10:04:24.0

SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.

Shenmao Technology Inc.

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing

Industry News | 2022-05-18 13:07:51.0

SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

Partner Websites: 240-250 (295)

ASM MS899 Wafer Mapping Die Sorter MS899-DL

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asm_MS899.html

: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surface pick type Pick/Bond Force: 40 - 250 g (adjustable

1st Place Machinery Inc.

Poron Cellular Urethane Foams Industrial Materials

ORION Industries | http://orionindustries.com/pdfs/PORONURETHANE.pdf

(replaces 4701-01, 4716-16, -01 & -71)TEST METHOD Density, lb./ft 3 ASTM D3574 Test A 15 20 25 15 20 30* 15 20 30 15 20 25 (kg/m 3) (240) (320) (400) (240) (320) (480) (240) (320) (480) (240) (320) (400) Tolerance, % ± 10 ± 10 ± 10 ± 10 PHYSICAL Standard Color

ORION Industries


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Blackfox IPC Training & Certification

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
convection smt reflow ovens

Software for SMT placement & AOI - Free Download.
Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
PCB separator

Find a wide selection of nozzles, solder materials, storage solutions and more at SALESCON