Electronics Forum: 2489 (Page 1 of 1)

Re: Misalignment Issue (CAD Vs. Machine Variables

Electronics Forum | Tue Nov 14 03:00:14 EST 2000 | sarry

I have one suggestion why don't you align all parts and take a close look at it if you can find any misaligned component after that. IF SO, that's machine's repeatibility problem.(or mechenical problem-dirty nozzle, wrong pick up and placement height

solder mask between qfp pads

Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the

liquidous (indium 8.9hf)

Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis

My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me

Re: solder mask between qfp pads

Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean

| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon

| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer

| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 16:54:57 EDT 1999 | Scott Cook

| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton

| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w

Re: solder mask between qfp pads

Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F

| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact

Re: solder mask between qfp pads

Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB

| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta

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