General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
TI New and Original CDCM61004RHBT in Stock IC VQFN32 21+ package CDCM61004RHBT 1:4 Ultra Low Jitter Crystal Clock Generator CDCM61004RHBT VQFN32 TI 21+ ATSAMC20J18A-AU TQFP64 MICROCHIP 22+ TPS92520QDADRQ1 HTSSOP32 TI 21+ SN74HCS165PWR TSSOP1
TI New and Original TLE2062CDR in Stock IC SOP8 22+ package TLE2062CDR Dual, 36-V, 2-MHz, In to V+, JFET-input operational amplifier CDCM61004RHBT VQFN32 TI 21+ ATSAMC20J18A-AU TQFP64 MICROCHIP 22+ TPS92520QDADRQ1 HTSSOP32 TI 21+ SN74HCS165
TI New and Original SN74HCS165PWR in Stock IC TSSOP16 22+ package SN74HCS165PWR 8-bit parallel load shift register CDCM61004RHBT VQFN32 TI 21+ ATSAMC20J18A-AU TQFP64 MICROCHIP 22+ TPS92520QDADRQ1 HTSSOP32 TI 21+ SN74HCS165PWR TSSOP16 TI 22+
United Chemi-Con New and Original EKXJ451ELL330ML20S in Stock IC N/A 21+ package EKXJ451ELL330ML20S 105℃ Lead Type Aluminum Electrolytic Capacitor KXJ Series CDCM61004RHBT VQFN32 TI 21+ ATSAMC20J18A-AU TQFP64 MICROCHIP 22+ TPS92520QDADRQ1 HTS
TI New and Original THVD1450DR in Stock IC SOIC-8 21+ package THVD1450DR 3.3V to 5V RS-485 Transceiver with ±18kV IEC ESD Protection CDCM61004RHBT VQFN32 TI 21+ ATSAMC20J18A-AU TQFP64 MICROCHIP 22+ TPS92520QDADRQ1 HTSSOP32 TI 21+ SN74HCS165P
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