Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2020-03-19 11:12:48.0
Amid the COVID 19 crisis, Precision PCB Services, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern California and Dallas, Texas.
Industry News | 2014-05-05 16:29:24.0
Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).
Industry News | 2017-04-22 11:52:53.0
Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2019-06-10 22:30:02.0
Climatest Symor launched the new fast dehumidifying dry cabinets,the moisture can lower to
Industry News | 2013-04-04 15:35:32.0
Engineered Material Systems, Inc., introduces the DF-1014 Dry Film Negative Photoresist for use in Micro-Electro-Mechanical Systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2013-06-14 17:52:56.0
Engineered Material Systems, Inc., introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS).
Industry News | 2013-10-04 16:50:46.0
Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.
Industry News | 2013-10-29 13:26:58.0
Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).
Industry News | 2015-01-06 17:08:54.0
Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF-3020 dry-film negative photo resist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.