Electronics Forum | Sun Oct 22 21:55:14 EDT 2006 | jgarver1
Fuji has the NP Series machine that is capable of 23" x 27" boards. I know Mydata can also run large boards, but I don't have the specs.
Electronics Forum | Wed Jun 03 16:26:37 EDT 2009 | wisch123
The most innovative new technology today is ccoming out of Fuji. They don't really advertise, so if you haven't gone to a show lately you might not have seen it. The machine is call the XPF-W and it sets the new standard for quality, accuracy, reliab
Industry News | 2018-06-17 16:35:01.0
The competition was fierce as 27 competitors went soldering iron to soldering iron in IPC’s Hand Soldering Regional Qualification Competition at SMT Hybrid Packaging 2018 in Nuremberg, Germany. Of the 27 boards submitted by the competitors only four of the electronic assemblies were functional. Taking first place and a cash prize of €300 was Catherine Cardinal-Simoan, Thales International, who earned 422 points out of a possible 445.
CNSMT J6719037A FC28-900352 Threaded joint over NIPPLE CNSMT J6719037A FC28-900352 Threaded joint over NIPPLE ASM placement machine 03007696-01 FESTO 197005 FET.A9-03093 PILZ Pilz PN0Z safety relay PNOZX1 DEK safety relay SMTYAMAHA YS pr
CNSMT [AJ17Y00] [AJ02215] NXT M3S tracheal line parallel cable FUJI CNSMT [AJ17Y00] [AJ02215] NXT M3S tracheal line parallel cable FUJI FEEDER main body CL24MM BODY KW1-M4510-000 AS -A24-1101 Filter cotton accessories YV100IIXG nozzle filter c
Technical Library | 2010-05-12 16:21:05.0
Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.
Technical Library | 2007-03-08 19:31:10.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.
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