Automated Desk Dispensing Machine - Efficient and Convenient ❙ Introduce of Desk Automatic Dispensing Machine Semiconductor packaging, PCB electronic parts fixation and protection, mobile phone, notebook shell bonding, LCD glass substrate packag
For Die attach / Die bonding / Potting / Casting / Encapsulating / etc.
This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.
Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
New Equipment | Soldering Robots
C-Prime Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm. The Nordson DIMA Desktop Series is a product range for ACF
New Equipment | Soldering Robots
C-Slide Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with a fixture size up to 250 x 250 mm. The Nordson DIMA Desk
New Equipment | Soldering Robots
C-Turn Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm. The Nordson DIMA Desktop Series is a p
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The
