Industry Directory | Manufacturer of Assembled PCBs / Soldering / Turnkey / Contract Manufacturer / Service Provider
Record Circuits is a full service circuit board manufacturing company with 30 years experience. We manufacture thru-hole assembly to surface mount assembly and everything in between.
Industry Directory | Pick and Place
Permatech Electronics started as an electronic circuit board assembly company in 1992. We established the Permatech Quality Assurance manual at the same time to place focus on our prime directive: quality.
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VP-2800HP-CL62-2H 2 heads 3x Analog cameras / HD camera upgrade possible 6 slot nozzle changer Optional dispenser head 62x 8mm CL Feeder slots in 2 bays 35x 8mm push feeder on West side included Optional paste / glue dispenser module Option
New Equipment | Industrial Automation
ABB PLC / ABB DCS Series： SC510 /ABB MOD 300 Kpl-plc excitation system planning characteristics 1. Scheduling operation by programmable controller and direct phase-shifting operation, with high reliability; 2. The second record of operation, high
Electronics Forum | Thu Jan 10 04:06:02 EST 2002 | wbu
Hi Ianchan, you mean you set up a line and wait 6h or 2h to go on with production ? Can�t believe that! Wolfgang
Electronics Forum | Fri Jun 06 13:26:53 EDT 2008 | gdzuber
Pb(N03)2 + H20. In any case I can understand that $38billion spent has done nothing to clean up the Pb legacy. Although the world chose Pb-free as an approach for now, it may change in time. Regards, Gary
Used SMT Equipment | Pick and Place/Feeders
Set of (3) Fuji AIM Pick and Place with over 400 Feeders included and (3) Spare Heads!!!!! Unit 1: Vintage: 2006 Four Heads - H12 (4) Feeder Trollies 32K hours Unit 2: Vintage 2007 Four Heads - (2) H12 &
Used SMT Equipment | Pick and Place/Feeders
Vintage: 2010 Software Release: V5.BZa Details: • Dual Gantry • (4) Heads-Head Configuration: (2) H12HS, HO1 & HO4 • Feeder slots: 45 per MFU • (3) MFU AND (1) MTUL • Low usage hours
Industry News | 2003-02-27 08:41:52.0
Elec & Eltek International Co. Ltd. (
Industry News | 2009-09-06 07:51:30.0
gtr module from Beijing Hengrun Science and Technology Co.Ltd
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2017-07-27 16:51:57.0
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.
00354974-01 ACTIVATOR LED 00354976-01 Power Supply 24V DC 00354977-01 Emergency Stop Button 00354978-01 Emergency Stop Switchgear 00354979S01 Simovert Masterdrive Lifting Axis 00354980S01 Simovert Masterdrive Feed Axis 00354981-01 Optocoupler
00350533-01 COMP.Magazine long W21,5/H11,1/LE37 00350544-01 RETROFIT KIT COVER CUTTING DEVICE S23 00350588S03 Sleeve with ball fixing compl. DLM1 / 12 00350661S01 O-Ring 10*1 Viton 75 00350662S01 O-Ring 10*1 Viton 75 00350833S01 STRIP MOTOR 12-1
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
SMALLSMT Wenzhou SMALL Technology co. ltd | https://www.smallsmt.biz/vp2800hpcl22-pnp-machine/
! (only possible if no north side push feeders installed!) VP-2800HP-CL22-2H North push feeder option VP-2800HP-CL22-2H This new machine is based on the same stable VP-2800HP machine design plus CL feeder. Working Area
| https://www.qy-smt.com/product-item/universal-pin-14077000/
50684332 NOZZ FJC, 2H/072C/203/176CL 50684361 NOZZ FL, 1C-125/90C-CN 50684333 NOZZ FJC, SL-040X320X255-CX 50684373 NOZZ FJ, TS-200X360X250-CX 50684334 NOZZ FL-062X460X275-CX 50684374 NOZZ FL, 2SL
