I would like to introduce my company, Addplus Electronic Pte Ltd in supporting you in your field of R & D and Prototyping . Situated in Singapore, we are specialise in PCBA assembly , SMT , Automatic Insertion and Burn-in board (BIB). We also do rewo
MAIN CTL 1336E-MCB-4UPGRD PROM, Language and CP, Firmware 4.03 1 1336E-MC1-SP23A PCB, Main Control 1336E, 2.03 Firmware, Frames A1-A4 1 1336E-MC2-SP23A PCB, Main Control 1336E, 2.03 Firmware, Frames B-H 1336E-MC
Electronics Forum | Thu Jul 23 07:33:28 EDT 1998 | The Wretched SMD
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. We don't even bother with 04
Electronics Forum | Fri Jul 24 09:50:13 EDT 1998 | Justin Medernach
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. We don't even bother wit
FUJI CP3 NOZZLE AGPH-9550 AGPH-9190 AGPH-9440 ITEM PART NO. PART DESCRIPTION 01 AGPH-9560 CP3/S PICK UP NOZZLE 0.7 02 AGPH-9410 CP3/S PICK UP NOZZLE 1.0 03 AGPH-9130 CP3/S PICK UP NOZZLE 1.3 04 AGPH-9050 CP3/S PICK UP
NXT nozzle NXT-H01-7.0G (AA07300/AA07310) Spare Name: AA07300 AA07310 NXT-H01-7.0G Specifications Model: NXT NOZZLE Head H01 Dia 7.0G. FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H01 AA0AS00 FUJI NXT H01 1.0 AA05800 F
Technical Library | 2006-05-13 13:07:53.0
This Excel Spreadsheet calculates the Wave Solder Contact Time automatically with given main Solder Wave width and Conveyor Speed. There is one chart where conveyor speed is expressed in meters/min and in another where it is expressed in feet/minute.
Technical Library | 2015-02-27 17:06:01.0
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art. The materials that are used to make the solder connections require higher temperatures. Due to the introduction of lead-free alloys, the boards need more heat to get the barrels filled with solder. This not only affects the properties of the flux and components, but the operation temperatures of solder machines become higher (...)First the impact of temperature will be discussed for the separate process steps and for machine tooling. In the experimental part measurements are done to verify the accuracy that can be achieved using today's selective soldering machines. Dedicated tooling is designed to achieve special requirements with respect to component position accuracy.