Electronics Forum: 325 (Page 1 of 8)

0201 Aperture design

Electronics Forum | Fri Oct 04 01:18:27 EDT 2002 | sarge

1.5. Width >= 4-5 Particle Diameters. Use the smallest opening to determine this. Using dimension of the smallest aperture width, you should be able to fit minimum of 4-5 solder balls side by side into the opening. For 0201 design, -400 mesh (type

Soldering to Inconel 600 Alloy

Electronics Forum | Wed Dec 22 12:32:30 EST 2004 | rlackey

Hi Steve, Sorry it was S62-325XM3 - must be the lead fumes getting to me! Rob.

Solderability

Electronics Forum | Thu Oct 27 11:45:09 EDT 2005 | Rob

S62-325XM3 from Cobar - we used this for soldering all sorts of battery terminations to pcbs, & did a better job than every other paste we ever tried. The flux is so agressive it sits in the corner growling.

Rework Stations

Electronics Forum | Fri Oct 03 15:18:27 EDT 2008 | davef

Good ol' general purpose, day-in, day-out ~$1k hot air rework stations are: * Pace ThermoFlo ST 300 Low Cost Hot Air Reflow System [ST 325 is digital] * Hakko FR-803B SMD Rework Station [FR-802 is digital]

BGA Non-wet (head in pillow)

Electronics Forum | Wed Nov 15 16:14:02 EST 2000 | Scott Welle

We are having non-wet (head in pillow) problems with Altera 484's similar to the problems discussed on 10/27 timeframe. Need contacts to those people having similar problems. Will those who had problems with Motorola 357 (ref Chris and Glenn on 10/

Re: Wet vs. Dry paste volume?

Electronics Forum | Wed Oct 28 15:34:45 EST 1998 | carlm

| Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | That information should be contained in the technical data sheets supplied by

BTU Paragon 150 Reflow Oven

Electronics Forum | Mon Sep 19 13:24:05 EDT 2005 | cyber_wolf

OK guys here is the skinny..... We need an oven that can handle lead free temps without slowing the belt speed under 28 or so in. per min. BTU tells me that they don't recommend an oven that maxes any less than 350 C. Is anyone using a paragon 150

Solder Clogging

Electronics Forum | Fri Jun 04 16:30:10 EDT 2010 | jdm2008

I am running a cemelot 5000 and I am having trouble with the solder clogging up the needle. When the solder is removed it almost appears if it has reflowed. I am using a 22 guage needle, and the problem occurs with both type 3 and type 5 solder pas

Printing problem, water soluble paste with gold plating PCB..

Electronics Forum | Tue Jul 31 00:48:55 EDT 2001 | Frank

Sorry I forgot to provide enough information. Stencil thickness is 6 mil Aperture width is 10 mil Aspect ratio (aperture area / wall area) = 0.72 Solder paste mesh size, type 3 (-325 +500) With this aspect ratio we can printing without any probl

Cleaning of 'No-Clean' paste

Electronics Forum | Tue Sep 07 06:24:07 EDT 1999 | Steve Cheung

We are changing over to a No-Clean paste soon and l was wondering how other people tackle the issue of stencil and PCB cleaning in high-volume production. The paste we are using is Cobar 325RX and its pretty sticky stuff let me tell you! Our proble

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