New Equipment | Assembly Services
The board is designed by customer and it's for Network interface controller. We did one-stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly). Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1
New Equipment | Assembly Services
The board is designed by customer and we did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1.6mm Surface: HASL Solder mask: Green
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Wed Apr 18 16:13:43 EDT 2012 | tomzee
Hello All. First time poster. I need to design a PCB which will include a Bumped-die type chip with 6mil (152.4 um) pad pitch. I read somewhere that FR4 type board may not be a good choice for such small footprint. I have not had to deal with board
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Parts & Supplies | Pick and Place/Feeders
Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
cycle is 4 hours, 158°F (70°C); 4 hours, -20°F (-29°C); 16 hours, 70°F (21°C) VII. Low Service Temperature The glass transition temperature for 3M adhesive 200MP is -31°F (-35°C). Many applications survive below this temperature (factors affecting
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7351-padstack-naming-convention_topic36_post3503.html
will hit a few exceptions (I currently use 4 in um and 3 in mils, and I have a few inch based pads (maybe 10) over 3 digits , but I'd rather have that, than all my 10 mil and 100 mil and 11 and 100 mil, etc. pads near each other. A software converter
