Industry Directory | Consultant / Service Provider / Manufacturer
Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
Electronics Contract Manufacturing, ISO 9002. SMT, Through hole, Mixed technology asseblies. ICT -Gen Rad 2286, Functional Test, Systems Intergration. Materials Management : Turn-Key and Consignment. SMT: fine pitch-15 mil, 0402, BGA. 4 SMT lines.
Advanced SMT Pick and Place Machine for PCB Assembly ❙ Introduce of Hanwha Pick and Place Machine Find the perfect pick and place machine for your assembly needs. Our advanced pick and place machine offers efficient and accurate component assembl
SMT Pick & Place Machines - Precision Component Assembly Solutions ❙ Introduce of Hanwha Pick and Place Machine High speed SMT line machine Hanwha SMT pick and place machine, Hanwha placement, Hanwha chip shooter with high quality and professiona
Electronics Forum | Thu May 29 17:19:51 EDT 2008 | dyoungquist
On 0402s we use 20x25 mil pads with a 15 mil gap between the pads on the pcb with ENIG finish, 5 mil stencil with a 1:1 aperture (20x25 mil) and SAC305 lead free solder paste. We very rarely see any tombstoning on 0402s using this setup.
Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo
Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen
Used SMT Equipment | Pick and Place/Feeders
Here is your chance to purchase a Fully Automated SMT Line in Good Working Condition at a Low Price Cost new was over $1,000,000+ Million! Equipment consists of the following items DEK 265 GSX Stencil Printer - Green Camera -
Used SMT Equipment | Pick and Place/Feeders
SMT Line Equipment Package For Sale consisting of the following items DEK 265 GSX Stencil Printer - Year 1999 Universal 4796L ChipShooter - Year 2000-2001 305+ Universal HSP Feeders of various sizes 16+ Universal HSP Feeder Carts Universal GSM2 - Du
Industry News | 2011-01-28 17:29:19.0
Count On Tools Inc. introduces new Ceramic Nozzle Series for the complete line of Universal Instruments Corporation’s (UIC) pick-and-place machines, including Genesis, Advantis, Flexjet and GSM.
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
Parts & Supplies | Pick and Place/Feeders
Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and
Parts & Supplies | Pick and Place/Feeders
SMT machine YAMAHA CL56mm Feeder SMT machine YAMAHA CL56mm Feeder YAMAHA CL Feeder: Yamaha CL 8*2mm Feeders for 0201 Part No: KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-000 Yamah
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
Panasonic CM602 Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place m
Career Center | Clifton, New Jersey USA | Engineering,Production
L3Harris is seeking an engineer to lead manufacturing and space vehicle integration related activities on the GPSIIIF and NTS3 program. The type of space flight hardware produced at this L3Harris location includes complex circuit card assemblies (CCA
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 14, (#ts#)) SMT Express, Volume 2, Issue No. 4 - from SMTnet.com Volume 2, Issue No. 4 Wednesday, April 19, 2000
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 14, (#ts#)) SMT Express, Volume 2, Issue No. 4 - from SMTnet.com Volume 2, Issue No. 4 Wednesday, April 19, 2000
Lewis & Clark | https://www.lewis-clark.com/shop/page/4/
+ Paste Inspection and Bridge Detection Quik-Tool Compliant Tooling (4 x 18″ modules) Ergo Arm Monitor Integrated Stencil Adapter (23″ to 29″ Stencil Frames) Power: 110/240V ~ 50/60Hz ~ Single Phase ~ 1500 Watts Max Condition
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. Test Vehicle The solder paste printing process was performed at a DEK265 series stencil printer. A 4-mil thick laser-cut electro-polished stencil was used
