New SMT Equipment: 4.1.1.1 (5)

330106-05-30-20-12-00 330106-05-30-20-12-CN

330106-05-30-20-12-00 330106-05-30-20-12-CN

New Equipment | Industrial Automation

Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Our company has many products in stock,which are immediately available.The warranty is 1 years which apply to a

Amikon Automation Equipment Co., LTD

330106-05-30-20-12-00 330106-05-30-20-12-CN

330106-05-30-20-12-00 330106-05-30-20-12-CN

New Equipment | Industrial Automation

Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Our company has many products in stock,which are immediately available.The warranty is 1 years which apply to a

Amikon Automation Equipment Co., LTD

Electronics Forum: 4.1.1.1 (2)

Solder wave

Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef

4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Parts & Supplies: 4.1.1.1 (1)

Samsung Samsung 8mm SMN Tape Feeder

Samsung Samsung 8mm SMN Tape Feeder

Parts & Supplies | Pick and Place/Feeders

Samsung 8mm SMN Tape Feeder Part List 0402 2P 4P 2P-L 4P-L A-1 ..2 J90650156B PROBE CABLE ASSY 8MM IT 1 1 1 1 1 ○ X SM1-MF08-202R1 IT OPTION ..2 J90650279B PROBE CABLE ASSY 8MM NONIT 1 1 1 1 1 X ○ SM1-MF08-230R1 NON IT OPTION A-2 ..2 J90651417A

ZK Electronic Technology Co., Limited

Technical Library: 4.1.1.1 (4)

A New Angle on Printing

Technical Library | 2009-06-25 14:49:50.0

Although blade contact angle is a critical stencil printing parameter, screen printers have so far been unable to vary it "on-the-fly", in software. The recently released Assembléon/Yamaha YGP printer has changed this, and has made new application research possible to study a crucial 01005 process variable for feature printing that previous researchers have ignored. We have designed the first robust solder paste printing process for 01005 components that uses only a single printer and stencil. We have studied transfer efficiencies across all the major parameters, with important results for reliable high-density equipment assembly. Our findings show that a variable blade contact angle can print fine features with wider process window, and reduce overall process variation between boards produced from a line.

Assembléon

Silicon Test Wafer Specification for 180 nm Technology

Technical Library | 1999-08-05 10:45:36.0

In 1998, the International 300 mm Initiative (I300I) demonstration and characterization programs will focus on 180 nm technology capability. To support these activities, I300I and equipment supplier demonstration partners must use starting silicon wafers with key parameters specified at a level appropriate level for 180 nm processing, including contamination and lithographic patterning. This document describes I300I's silicon wafer specifications, as developed with the I300I Silicon Working Group (member company technical advisors) and SEMI Standards.

SEMATECH


4.1.1.1 searches for Companies, Equipment, Machines, Suppliers & Information

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