New Equipment | Board Handling - Storage
TI New and Original TPA3129D2DAPR in Stock IC HTSSOP-32, 21+ package TI New and Original TPA3129D2DAPR in Stock IC HTSSOP-32, 21+ package Today's Hot Deals： DR331-513AE SOP-4 BOURNS 19+ 61300211121 NULL WURTH 17+ TJA1043TK/1Y HVSON14 N
New Equipment | Assembly Services
TI New and Original SN74LV595ARGYRG4 in Stock IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+ package TI New and Original SN74LV595ARGYRG4 in Stock IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+ package TI New and Original SN74LV595ARGYRG4 in Stock
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
TI New and Original TPA3129D2DAPR in Stock IC HTSSOP-32, 21+ package TI New and Original TPA3129D2DAPR in Stock IC HTSSOP-32, 21+ package Today's Hot Deals： DR331-513AE SOP-4 BOURNS 19+ 61300211121 NULL WURTH 17+ TJA1043TK/1Y HVSON14 N
TI New and Original SN74LV595ARGYRG4 in Stock IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+ package TI New and Original SN74LV595ARGYRG4 in Stock IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+ package TI New and Original SN74LV595ARGYRG4 in Stock
Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application
