Industry Directory | Manufacturer
China based manufacturer looking to buy SMT Machines for own consumption.
New Equipment | Component Counters / SMD Counters
https://visiconsult.de/qr-xrhcount-en || https://youtu.be/thhVkwOkl94 XRHCount – the booster for modern pick and place applications Today, mass-market electronics are manufactured almost exclusively on high-performance assembly machines. Time is
Electronics Forum | Thu Feb 24 20:47:27 EST 2000 | Todd Woods
The camera is important. I found the only machine, granted this was a year ago, capable enough for volume production, was the KME CM-88. Our test had 1 mispicked device of 5,000,000 attemps and 0 misplacements.
Electronics Forum | Tue Jul 10 08:45:12 EDT 2001 | stefwitt
There are several low cost vision systems ( under $ 5,000) on the market: http://www.dvtsensors.com" ,Keyence, Texas Instruments, Imagenation. If they can capture the image in one shot ( comparing with one good board ) depends on the camera resolutio
Used SMT Equipment | Soldering - Selective
• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom
Used SMT Equipment | Pick and Place/Feeders
Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability
Industry News | 2008-09-02 15:34:36.0
Minneapolis, MN � The 2008 Charles Hutchins Educational Grant recipient, Lei Nie, a graduate student in the field of Mechanical Engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process".
Industry News | 2013-07-08 17:38:14.0
During the months of July, August and September, PROMATION is offering exceptional deals on its TT-400 robotic soldering system.
Lewis & Clark | https://www.lewis-clark.com/
: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability Dual-Vision Alignment System Integral Vacuum Max Placement Area: 13.8″ x 17.1
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/top-10-smt-new-product-stories-of-2014_topic1520_post6150.html
range of production levels and budgets. At #5, Panasonic Introduces NPM-D3 to SMT Platform: "The NPM-D3 brings the industry's first, single-unit camera for alignment, thickness, and coplanarity," said Mark Ragard, GM, Electronics Assembly Sales