The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
Electronics Forum | Tue Jan 11 11:08:03 EST 2005 | clarkk
Hello, We are assembling a large pcb with 256 Lumex #SSL-LXA228SRC-TR31 SMT LED's on an HSP 4791. The part I'm using for the library is a modification of an existing SMT LED from the standard library. The problem is that the HSP rejects about 30% of
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
S/N 60075 & S/N 60076 These 2 units came off the production floor in full operation. They were properly shut down secured and shipped to the Midwest warehouse and a dual set of Calibration Jigs are also available. Inspection available upon requ
Industry News | 2013-07-08 17:38:14.0
During the months of July, August and September, PROMATION is offering exceptional deals on its TT-400 robotic soldering system.
Industry News | 2018-09-20 10:59:07.0
Emission-free, fully autonomous and networked throughout the entire world as well – that’s more or less what the car of the future will look like. Thanks to rapid progress in the field of electronics, the vision of fully autonomous vehicles – something that seemed inconceivable just a few years ago – is now within our reach.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
. The MV-6 OMNI combines MIRTEC s exclusive 15 Mega Pixel CoaXPress Camera Technology with their proprietary OMNI-VISIONï¿½ 3D Digital Tri-Frequency Moirï
. The MV-6 OMNI combines MIRTEC s exclusive 15 Mega Pixel CoaXPress Camera Technology with their proprietary OMNI-VISION 3D Digital Tri-Frequency Moir Technology to provide precision inspection of SMT