Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
E1405728000 DRUM BRACKET 05 E1406706C00 A SCREW M3X5.5 E1406717000 SBGA CYLINDER BASE E14067190A0 COVER BRACKET A A E1407717000 SBGA CYLINDER PLAT E1407719000 COVER BRACKET B E1409725000 COVER CUC E1410719000 HOOK PIN E14107260A0 TRAY CHUCK R
E1405728000 DRUM BRACKET 05 E1406706C00 A SCREW M3X5.5 E1406717000 SBGA CYLINDER BASE E14067190A0 COVER BRACKET A A E1407717000 SBGA CYLINDER PLAT E1407719000 COVER BRACKET B E1409725000 COVER CUC E1410719000 HOOK PIN E14107260A0 TRAY CHUCK R
Siemens HS60 parameters Placement head type: 12-nozzle collection and placement head Number of cantilevers: 4 Theoretical mounting rate: 60000cph Component range: 0.6mm x 0.3mm (0201) to 18.7mm x 18.7mm The highest placement accuracy (4 sigma):
00386587-02 Retrofit Kit LCD Monitor on SIPLACE S/F 00386900-02 Upgrade Package SIPLACE Pro (V5.2) 00386901-01 Setup Center update Package V3.0 00386910-01 Software-Update (unattended) WIN XP SP3 00386960-02 Siplace Pro V5.2 - LANGUAGE PACK 0038
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
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