Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Thu Mar 28 10:11:00 EST 2002 | cyber_wolf
I use a .059" copper clad sheet of FR4 that I bought from one of our board houses. It has not started to delaminate yet, and it has been through our ovens several hundred times. I am not sure what the life expectancy of a thermo-couple is. I am not 1
Electronics Forum | Thu Mar 28 03:19:54 EST 2002 | Opor
Hi All Does anybody have done the profiling board life time experiment? What is the proper life time of FR4 profiling board? How can we know when the profile board or thermocouple should be change?How to use dummy board instead of using gold/real
Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M
I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5
Electronics Forum | Wed Oct 01 13:19:18 EDT 2008 | evtimov
I am also doing research on rework machines. for now I saw : Ersa - german http://www.ersa.de/en/produkte/smt_bga_rework/frame_smt_bga_rework.html DenOn- Japanese http://www.denondic.co.jp/en/products/rd500_2.html, Metcal http://www.metcal.com A
Electronics Forum | Thu Nov 05 23:24:56 EST 2020 | neosroger
I would like to request your expertise on which pasta printer to purchase: MPM Momentum + EKRA XPRT 3 Both of them are refurbished/ reaconditoned. The MPM includes several perpetual Software licenses but it is almost double the price of the EKRA
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
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