.jpg)
New Equipment | Industrial Automation
TRICONEX 5382 Analog Output High-Current TriPak TRICONEX 5351 Analog Input TriPak Email:sales2@amikon.cn Skype: ariatang111 Mb(Whatsapp):+86-18020776791 Wechat:18020776791 Tel:86-592-5321698 About TRICONEX Main Processors The Main Processors
New Equipment | Industrial Automation
TRICONEX 5382 Analog Output High-Current TriPak 1 CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 AMIKON LIMITED Dedicated to Global Auto Parts Search Control Industry (GP
Electronics Forum | Tue Jul 30 21:44:13 EDT 2002 | sohct
Hi Anyone has experience in manufacturing RF PCB and encounter voids on the grounding pads? The grounding pad is covered by the a big component. Question is does voids in the solder joint affect the RF operation?
Electronics Forum | Tue Feb 27 11:28:08 EST 2001 | fkurisu
Hello Mark, It is possible that SolderMask, Inc. could selectively remove the existing solder mask, clean and reapply a Photoimageable solder mask to the BGA area. Mostly likely the mask on your boards is a Liquid Photoimageable Solder Mask (LPIS
Used SMT Equipment | Coating and Encapsulation
SCS Cure Oven 5382 Vintage: 2018 Like New - Limited Use Exclusive Sale - Closed Bid Auction In Conjunction With Baja Bid https://bajabid.hibid.com/lot/62337153/2018-scs-cure-oven?utm_source=BenchmarkEmail%2CBenchmarkEmail&utm_campaign=KSR_
Career Center | Dallas, Texas USA | Engineering
Senior RF Engineer: BSEE required MS preferred. 5-10 year experience in product design, 2GHZ products, CAD tools, strong verbal and written skills. Duties include to review and test design development skills. Customer contact program management.
