863 exhibits excellent wettability, extended stencil life, superior hot slump, and low voiding. Flux class ROL0. Exceeds J-Std-006. 863 provides excellent print definition. Good release is seen on 12-9 mil apertures with print speed of 1.0-6.0 inch p
866 exhibits excellent wettability, extended stencil life, superior hot slump, and low voiding. Flux class ROL0. Exceeds J-Std-006. 866 provides excellent print definition. Good release is seen on 12-9 mil apertures with print speed of 1.0-6.0 inch p
Electronics Forum | Tue May 30 07:41:21 EDT 2006 | davef
Aspect ratio: The ratio of a via�s length or depth to its pre-plated diameter. So, in your case, either * 6=0.093/x, calculating x=0.093/6=0.016 as the smallest via hole diameter. ... OR * 6=y/0.01, calculating y=6*0.01=0.06 as the maximum board th
Electronics Forum | Thu Apr 04 16:38:51 EST 2002 | davef
Equipment companies like to talk about �accuracy� and �repeatability�. These measures provide limited information. Flaws of the measure aside, some printer companies have begun to report Cp. * DEK ELA: Cp = 1.33 @ �0.025mm * DEK 265: Cp = 1.6 @ �0.0
Genrad 2286E-9723 In-Circuit Tester Configuration: (1) MTG [9004-0108]; (1) HSC [2277-4711] (1) CST [2277-4712]; (1) DS Ref [2277-4750] (14) Combo 1 [2277-4020] (1) Combo 1a [9004-0475] (1) AFTM [9004-0040]; (2) 0-7V P/S (6) 0-20V P/S; (1) 0-
Industry News | 2009-04-15 16:59:04.0
Garden Grove, CA � April 15, 2009 � Techcon Systems, a division of OK International and a leading provider of fluid dispensing systems, introduces the new TS6500CIM Series Cartridge Mixer.
Standard: TCM-V1000 Brand: SANYO Introduce: SANYO TCM-V1000 SMT NOZZLE Part No. Description TCM-V1000-N81 TCM-V1000 PICK UP NOZZLE ￠0.6/￠0.3 TCM-V1000-N11 TCM-V1000 PICK UP NOZZLE ￠0.9/￠0.6 TCM-V1000-N71 TCM-V1000 PICK UP NOZZLE ￠1.
Smt sanyo nozzles V820 V822 nozzle used in pick and place machine SANYO TCM 3000 SMT NOZZLE Part Number Description 6300529586 TCM SANYO SMT NOZZLE 3000 - ø 0.6 / ø 0.4 6300523609 TCM SANYO SMT NOZZLE 3000 -ø 1.5 / ø 0.5 6300529616 NZ. ø 1.8 /
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2019-05-30 11:02:07.0
In a previous Tech Tip (see Battery Selection for Electronic Systems), considerations were discussed for selecting an appropriate battery for an application. After selection, testing should be performed to confirm that the battery can provide the power required for the specific application. Some battery definitions should be understood when discussing power load qualification testing of batteries.
Facilities: 220VAC, 1phase, 50/60Hz, 10Amp / Air: 0.4 - 0.5 Mpa Dimms: 40 X 51 X 57 in. @ 1654 lbs Product Terms: This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functi
BTW, we have sepcialzied in SMT field over 12 years and support one-stop SMT solution for our customers. Including SMT equipment and spare parts, such as Loader and Unloader, Reflow oven, Nozzle, feeder, motor, PCB board ect. We can also customize
Career Center | ZAGHOUAN, Tunisia | Engineering
-Giving support to the SMT lines, pick and place machines, AOI, printers paste, reflow ovens, paste inspection, conformal coating dispenser. -Provide solutions on failures and equipment maintenance, as well as program updates and documentation. -Sett
7.0 - 10.0 ¿¿ Feldspar [Na,K] (Al Si3O8), CaAl2Si2O8 11.8 % Na2O, 16.9 % K2O, 20.2 % CaO 6.0 2.5 - 2.8 FLOTIGAM® 4343, FLOTIGAM® 2835 FLOTANOL® 7026 H2SO4 Na2SiF6, Na2SiO3 HF, NaF
: 8.0 PF 2500 Controller Core Pull 40mm Barrel 20,000 Max Injection (PSI) Platen Distance: 25.00 x 25.00 Tie Bar Distance: 17.00 x 17.00 Min. Max Stack: 6.0 x 16.0 Clamp Stroke: 14.0 Ejector Stroke: 3.0 Good Working Condition Price