Electronics Forum | Fri Jan 30 07:28:10 EST 2009 | abhishek30781
can i get the comparision sheet between NXTII and CM602
Electronics Forum | Thu Aug 03 10:53:23 EDT 2000 | Roni Haviv
Hello, Does enyone have any experience with Immersion Tin (Sn) as a finish process on PCB ? Any information will help ! Thanks Roni
Electronics Forum | Thu Aug 12 21:06:48 EDT 2010 | ptpaazmi
COLD SOLDER LOCATION U600/U601 Problem : Several XMp3i Rotary swithes were found to exibit intermittent function during a DV build at WNC
Electronics Forum | Tue Aug 24 20:15:27 EDT 2010 | davef
What is ... and how does it pertain? * Location U600/U601 * XMp3i Rotary swithes * DV build * WNC
Electronics Forum | Mon Oct 05 10:08:54 EDT 2015 | swiese242
I have a HVC 102 reflow oven that will randomly shut down for over/under heat. On the 601 overheat protection zone 4 will read over 500c. Has anyone had this problem?
Electronics Forum | Thu Jul 06 16:13:28 EDT 2017 | barryg
Hello everyone, I was curious if anyone knows what criteria there is for layer to layer registration. I have looked at ipc-600 and 601 and have not found anything or am missing something. We had a small qty. of pcbs sent to a customer and some inner
Electronics Forum | Thu Nov 30 15:18:54 EST 2000 | Rich Z
All, I have a reoccurring issue with the Alpha-Metals WS601, water-soluble paste in that the size 20 nozzle of the auger-type dispenser on my Camalot Gemini II clogs up rather frequently. Every few hours we are having to go in and clear out the nozz
Electronics Forum | Mon Apr 04 22:40:07 EDT 2005 | davef
We'd contact suppliers of LPISM. Top LPISM available in the United States are: * Coates ImageCure XV501T & XV501TSM * Coates ImageFlex (Flexible Solder Mask) SV 601T * Enthone DSR 3241 and DSR 3241 GM * Rogers RFlex 8080 LP1 & RFlex 8080 LP3 (Flexib
Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks
We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing
Electronics Forum | Tue May 24 19:35:36 EDT 2005 | davef
Certainly, most often, the focus of pot analysis is directed at controlling impurities. Maintaining proper level of tin is important, also. When the portion of tin decreases: * Liquidous temperature increases. * Ability to wet decreases. * Solder c
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