New Equipment | Solder Materials
For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
Electronics Forum | Tue Aug 14 21:51:29 EDT 2001 | mugen
true.... tata why the elongation% is there.....
Electronics Forum | Tue Jan 23 17:21:30 EST 2007 | russ
Which characteristics? Russ
Industry News | 2018-10-17 20:06:14.0
Nathan Trotter announces that it was awarded a 2018 Global Technology Award in the category of Solder Bar for its SAC 305 Solder Bar. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.
Industry News | 2018-11-16 19:02:38.0
Nathan Trotter announces that it was awarded a 2018 Mexico Technology Award in the category of Solder Bar for its SAC 305 Solder Bar. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2013-07-11 15:22:40.0
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/61?order=list_price+asc
0.0 CNY FILTER ELEMENT PF3-24-005-01 ¥ 0.00 0.0 CNY Solder Paste 96.5Sn/3Ag/0.5Cu ¥ 0.00 0.0 CNY Solder Paste 63Sn/37Pb ¥ 0.00 0.0 CNY Prev 58 59 60 61 62 63 64 Next products and services Surplus placement machine SMT peripheral equipment product information contact us
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
2X rework1,2. This however, was only required on an extremely small percentage of card types. The majority of PTH reworks were capable of using the one alloy type (i.e. eutectic 63Sn-37Pb). However, now with having to use Pb-free alloys such as SAC305
