Electronics Forum | Wed Apr 25 03:31:53 EDT 2007 | GS
http://eur-lex.europa.eu/smartapi/cgi/sga_doc?smartapi!celexplus!prod!DocNumber&lg=en&type_doc=Decision&an_doc=2006ν_doc=691 Lead (Pb) in finishes of fine pitch components,see ANNEX item 23. GS
Electronics Forum | Wed Sep 15 07:34:49 EDT 1999 | Edmund
Hi, Can someone pls suggest to me the best reflow temperature setting for a force air convection oven. The details is as follow. 1) Heller 1700s 2) 12 zone---6 top and 6 bot 3) Solder paste --- Qualitek 691 non clean 4) board size : 159mm X 159mm
Electronics Forum | Tue Jun 27 08:08:23 EDT 2000 | Christopher Lampron
Hello All, My question is in regards to repackaging moisture sensitive components. I have researched the archives and found alot of valuable information. We currently have a heat sealing machine but do not have the capability of evacuating the bag pr
Electronics Forum | Mon Jul 10 12:39:07 EDT 2000 | Chris C
Hi Christopher, To my knowledge, heat seal along will not provide you the desire condition. Currently, we're using vacuum sealer to reseal all MSD restock items. If you have variety of package and constantly need to reseal the MSD parts, I'd like to
Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup
Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the
Electronics Forum | Sat Mar 24 00:50:24 EST 2001 | PeteC
Fresh paste from a factory sealed container. Should paste be scrapped out altogether if left on the stencil for too long (length-of-time?)? Our paste is Multicore CR39. Multicore reccomended the print chamber be around 22C @ 50%-60% RH. Our plant is
Electronics Forum | Wed Sep 15 07:43:12 EDT 1999 | Earl Moon
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Wed Sep 15 10:55:21 EDT 1999 | Scott S. Snider
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Wed Sep 15 12:07:50 EDT 1999 | Earl Moon
| | Hi, | | | | Can someone pls suggest to me the best reflow temperature setting | | for a force air convection oven. The details is as follow. | | 1) Heller 1700s | | 2) 12 zone---6 top and 6 bot | | 3) Solder paste --- Qualitek 691 non clean | |
Electronics Forum | Wed Aug 12 18:06:33 EDT 2015 | bnorton
Here's the end of Logicomm capture on Force COMM2 where it starts the Lantern system not active messages. Couldn't get attach to work. Startup and earlier .ldx file loading omitted ulLoadTasks(): Opening the RFS pseudo device driver ... ulLoadTas
