Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer / Marketing Agency / Other
SMTBOX supplies SMT feeders, SMT nozzles, SMT tools and SMT consumables to electronics manufacturing services companies globally and also has created win-win partnerships with SMT vendors and distributors to the worldwide.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Electronics Forum | Thu Jul 19 18:15:15 EDT 2012 | jil2000
We have a material that is been stick at cover tape, only 1 supplier is failing and only embossed tape packing is failing. A dark spots between tape and component are observed, we already bake material to se if is humidity, is not. We already apply
Electronics Forum | Thu May 04 10:14:31 EDT 2017 | sssvajunas
If 8mm component tape is cut off until components (no empty tape) how can I load it in to a ax feeder without throughing compoents?
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2011-04-22 21:36:56.0
GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.
Industry News | 2017-10-02 13:58:42.0
GPD Global will exhibit at the upcoming IMAPS 2017. At booth 244, GPD Global will exhibit a complete line of Fluid Dispensing pumps with the latest dispense technologies for integration or retrofit. Whether your process requires low or high viscosity fluids, thick pastes, or abrasive media, there is a dispense pump to meet your requirements.
Parts & Supplies | Pick and Place/Feeders
40081851 TAPE HOLDER ASM 40081802 STOPPER SP 40081792 FEED WHEEL 2MM 40081824 FEED WHEEL 4MM 40081803 KNOCK LEVER LINK 2MM ASM 40081826 KNOCK LEVER LINK 4MM ASM 40081833 UP CV 03 05 ASM 40081845 UP CV 08 ASM E32037060AC UPPER COVER 1212 ASM.
Parts & Supplies | Pick and Place/Feeders
X01M1508304 Pulley N210059227AA,1089651060AA BM FEEDER N210101473AA 108620900801 1086209008 N210056315AA Feeder Guide 10485S0003 WHEEL MV2F 8*2 N210056316AA 40961AA X01M1508405 N610057275AA BM8*4 X708-077 X708-S0000 TAPE GUIDE KXF01F0AA
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
KingFei SMT Tech | http://www.smtspare-parts.com/sale-10184707-yv100ii-nozzles-for-chip-component-2125-for-yamaha-surface-mount-2-mm.html
YV100II Nozzles For Chip Component 2125 For Yamaha Surface Mount Φ2 mm Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
/91 Specifications2-9 Figure 9 Vertical Component Elements 2.2.4 Processing Ranges (continued) In the figure and chart below: B = Body to Bend H = Height of Leg C = Crimp Height R = Bend Radius Vertical Components Inches Metric (mm) Dimension Minimum
