ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
PAC-VAC® vacuum tool kit, battery operated. The PAC-VAC® is battery operated and self-contained, runs up to eight hours continuously on one 9 volt alkaline battery. This versatile unit can be clipped to your belt or pocket for one-handed portable ope
These vacuum pens are ideal for SMT assembly or for handling any parts that have a non-porous surface. No batteries or hoses to get in your way. The vacuum cups are Static Dissipative and nonmarking. Featured Models: V8901-KIT-B PEN-VAC® Kit With
Electronics Forum | Tue Jul 19 03:06:42 EDT 2016 | ishwarsingh1
Upside down placement of a crystal oscillator is acceptable or not ?? As per IPC 220.127.116.11.2 Rectangular or Square End Chip Components – 1, 3 or 5 Side Terminations.I am not sure whether is applicable for crystal oscillator or not . Your answer wo
Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Includes Parts Tray Feeder OS: Windows XP SW: 18.104.22.168 Cameras: Front ULC magellan firewire 1394 .94 mil per pixel. Rear ULC firewire 2.3 per pixel. Pecs: pec beam1 firewire 1394 .66 mil per pixel. pec beam 2 firewire 1394 .
Industry News | 2018-07-17 19:28:35.0
Virtual Industries features a product line of hand tools that replace tweezers or other gripping means for many applications. The PEN-VAC Kit with 8 Probes + Cups and Vacuum Pen Holder is a completely self-contained unit. There are not any batteries or hoses to get in the way.
Industry News | 2009-02-09 16:00:37.0
COLORADO SPRINGS, CO � February 9, 2009 � Virtual Industries, Inc., a leading supplier of manual vacuum handling solutions, introduces the self-contained manually operated PEN-VAC PRO-SERIES Vacuum-Tweezer for handling SMD packages, optics or other small parts during assembly. The tweezer has no vacuum hoses to get in the way and no batteries to replace.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
Career Center | Toronto, Ontario Canada | Engineering,Production,Purchasing,Sales/Marketing
A dedicated professional with 17+ years of experience in product management, marketing, project management, engineering and manufacturing. Demonstrated ability to interact with customers and manage cross-functional teams to drive business growth. 4+
Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Embedded passives