00304139S01 TENSION SPRING 00304140S01 PRESSURE SPRING 00304141S01 SPHERICAL LINER 4*8*10 L 408 X 00304142S01 DEEP-GROVE BALL BEARING D=9/D=14/B=3 00304146-02 PROXIMITY SWITCH HOLDER 00304151S01 DEEP-GROOVE BALL BEARING D=12/D=
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.