New SMT Equipment: 80014 (6)

Honeywell  51204172-125 Analog Output Module

Honeywell 51204172-125 Analog Output Module

New Equipment | Industrial Automation

Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Our company has many products in stock,which are immediately available.The warranty is 1 years which apply to a

Amikon Automation Equipment Co., LTD

A-B	1785-L40B

A-B 1785-L40B

New Equipment | Industrial Automation

Want to buy best parts with a competitive price ? Please check it with Email:unity@mvme.cn ! we will response you in 24 hours! Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ

Moore Automation

Electronics Forum: 80014 (1)

No such thing as a Compact Reflow Oven?

Electronics Forum | Tue Mar 20 03:58:30 EDT 2018 | reckless

Thanks, what is the smallest oven with an edge conveyor? How come no one is thinking about the little manufacturer not the huge contract manufacturers?

Technical Library: 80014 (1)

The Last Will And Testament of the BGA Void

Technical Library | 2015-01-05 17:38:26.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Rockwell Collins


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