Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Industry News | 2015-05-18 21:29:50.0
The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.
Industry News | 2013-11-08 18:26:23.0
AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.
Technical Library | 2020-07-02 01:14:44.0
Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,
Parts and Assembly Storage Life: How to Determine and Manage
SMTnet Express, July 2, 2020, Subscribers: 28,589, Companies: 11,034, Users: 25,930 A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS Credits: Cookson Electronics Head-in-Pillow (HIP) defects are a growing concern
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
dictated by the current FPC with Time Pressure Control - Integrated material recipe. FPC with Time Pressure Control - Integrated is simple to set up and use: 1. Set up: a. Mount your reservoir(s) in the provided head station mount(s). b. Connect the fluid
) to determine the alloy composition of the metal. This is a common method used when the composition of the component alloy or surface finish is in question