Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
UV-Lamp Weathering Test Chamber takes fluorescent UV lamps as light source to simulate the UV irradiation in natural light and condensation to conduct accelerated weathering test on the materials, It simulates UV, rain, high temperature, humidity, co
Electronics Forum | Tue Mar 04 09:12:35 EST 2008 | davef
Q1. What would you recommend for the best practice or comparison? A1. We'd go with dip & look. It's easy and cheap, requires no advanced degrees in measurology. Have you reviewed "J-STD-002B - Solderability Tests for Component Leads, Terminations, Lu
Electronics Forum | Tue Mar 20 09:03:18 EST 2001 | moseschee
Hi, I'm looking for research/study done on solder shelf life by using accelerated aging process ( steam age or dry air oven bake at 150C & etc ) Perhaps you could help to advise correlation of all this acceleration test to actual solder shelf life
Industry News | 2016-12-20 13:18:31.0
The SMTA is pleased to announce the Best Papers from SMTA International 2016. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, Best International Paper, as well as a $500 award for Best Student Paper.
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
. Accelerated aging tests conducted on both extruded tubing and injection-molded test samples show significant improvement in resistance compared to unmodified materials
. But too thick an intermetallic layer has an adversely effect because it is generally the most brittle part of the solder joint. Compared to lead-based solders, SnAgCu solders require a higher reflow temperature which leads to accelerated diffusion rates