Industry Directory | Consultant / Service Provider / Manufacturer
BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center
Industry Directory | Manufacturer
TMX caters to multiple markets with its EMS / SMT services. We can assist from design through to final logistics stages. Our Juarez location is ideal to ship to both North & South American markets.
Stinger90 is an off-line X-ray inspection and industrial CT system with the highest voltage of 90kV, which is designed for electronic industry. It can meet the needs of X-ray inspection of PCB, SMT, small electronic components, semiconductor packagin
Smart160 is an off-line X-ray inspection and industrial CT system with the highest voltage of 160kV, which is designed for electronic industry. It can meet the needs of X-ray inspection of PCB, SMT, small electronic components, semiconductor packagin
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D
Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,
Used SMT Equipment | Repair/Rework
Lead Free Preheater with fume extractor for rework. Includes: stand show in picture OKI fume extractor with hoses and filters (model: BVX-200) Hakko FR-802 available separately This unit is located in the CEE facility in the Chicago
Used SMT Equipment | Pick and Place/Feeders
60,000cph with a large component range of 0201 to 30mmx30mm. Flexible, high-speed productivity for medium volume environments. A powerful line booster solution or high-performance small part placer. Dual-beam, dual-drive overhead gantry system
Industry News | 2008-07-03 21:21:50.0
OXFORD, CT � July 2, 2008 � MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.
Industry News | 2020-10-03 08:34:38.0
MIRTEC is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
Technical Library | 2007-11-29 17:20:31.0
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.
Technical Library | 2021-11-22 20:39:44.0
Quality control is a key activity performed by manufacturing companies to verify product conformance to the requirements and specifications. Standardized quality control ensures that all the products are evaluated under the same criteria. The decreased cost of sensors and connectivity enabled an increasing digitalization of manufacturing and provided greater data availability. Such data availability has spurred the development of artificial intelligence models, which allow higher degrees of automation and reduced bias when inspecting the products. Furthermore, the increased speed of inspection reduces overall costs and time required for defect inspection. In this research, we compare five streaming machine learning algorithms applied to visual defect inspection with real world data provided by Philips Consumer Lifestyle BV. Furthermore, we compare them in a streaming active learning context, which reduces the data labeling effort in a real-world context. Our results show that active learning reduces the data labeling effort by almost 15% on average for the worst case, while keeping an acceptable classification performance. The use of machine learning models for automated visual inspection are expected to speed up the quality inspection up to 40%.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
This video describes what it takes to bring IPC A-610 training inside of a company. The list of things that need to be in place includes: a trained instructor, IPC-A-610 slide deck for training, a projector, standards for all participants and a perso
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | Huntington Beach, California USA | Engineering
Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select
| https://www.eptac.com/webinar/ipc-7095c-the-definitive-source-for-everything-bga/
IPC-7095C – The Definitive Source for Everything BGA | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
correlation between solder joint void size/location and solder joint thermal cycle integrity existed for the thermal cycle range of -55°C to +125°C; (2) derive a BGA/CSP solder joint void criteria for submission to the IPC-JSTD- 001 committee. PROCEDURES Test
