Industry News: acf (Page 1 of 2)

Desktop Systems Provide Flexible Bonding

Industry News | 2003-06-10 08:39:25.0

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

SMTnet

SMTA Announces Best of Conference From 2014 Pan Pacific Symposium

Industry News | 2014-03-11 17:31:51.0

The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK's Next Generation Dispensing and Conformal Coating Systems and Software to be on Display at IPC APEX 2016 Booth 1841

Industry News | 2016-03-09 16:11:24.0

Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK Exhibits Innovative Technologies for Dispensing and Conformal Coating Systems at IPC APEX 2017 Booth 1611

Industry News | 2017-02-02 10:26:34.0

Nordson ASYMTEK, a Nordson company will exhibit its latest and most popular technologies for fluid dispensing, jetting, conformal coating, and hot bar soldering in booth 1611 at the IPC APEX tradeshow, in San Diego, California, being held February 14-16, 2017. ASYMTEK is joining its sister Nordson companies to support IPC as it celebrates its 60th year in the electronics manufacturing industry.

ASYMTEK Products | Nordson Electronics Solutions

Finetech Unveils High Force ACF Bonder

Industry News | 2013-11-08 18:07:48.0

Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

Finetech

Nordson DIMA Launches New Website to Promote Hot Bar Soldering and Bonding Capabilities for the Electronics Industry

Industry News | 2017-07-17 19:09:09.0

Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.

C-Tech Systems, B.V. [formerly Nordson DIMA]

Nordson DIMA hot bar soldering solutions, fluid dispensing, and coating systems to be demonstrated at SMT Hybrid 2018

Industry News | 2018-06-04 18:24:29.0

Nordson DIMA, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit a range of products for hot bar soldering, as well as fluid dispensing and coating systems, at SMT Hybrid 2018 in Nuremberg, Germany, June 5-7, 2018, in the AAT Aston GmbH stand, Hall 4, booth 241.

C-Tech Systems, B.V. [formerly Nordson DIMA]

New G4C Ceramic Hot Bars (Thermodes)

Industry News | 2014-07-16 20:05:16.0

Backward Compatible G4C Ceramic Hot Bars Designed for Legacy TC-1000 and TC-1200 Toddco Temperature Controllers

Toddco3

Koh Young Shares Insights about Automating the Inspection Process

Industry News | 2021-06-21 10:47:58.0

Koh Young, the industry leader in True3D™ measurement-based inspection solutions, will participate in a free panel discussion about automating the electronics assembly inspection process on Tuesday, 06 July 2021 at 10:30AM EST. Register today and secure your seat in the virtual event to learn more about the best practices for the automatic optical inspection process from Koh Young America and others. Register by pasting the following link into your browser https://action.globalsmt.com/c1.pl?d75b2cd565b10e4900ae4096e6dc26f8f20681acf9316cdb

Koh Young America, Inc.

Bonding Platform FINEPLACER� Micro MA � Accuracy Meets Flexibility

Industry News | 2007-11-27 12:13:09.0

FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.

Finetech

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