ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t&page=4
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t&page=3
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t&page=1
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t&page=2
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material and applying a certain amount of temperature and force, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating?con=t&page=3
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material and applying a certain amount of temperature and force, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/events/smtconnect-2019
. The C-Tack Desktop System is specially designed for ACF Laminating (Pre-Tacking, or Pre-bond) applications. ACF (Anisotropic Conductive Film
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/events/smt-hybrid-packaging-2018
(Pre-Tacking, or Pre-bond) applications. ACF (Anisotropic Conductive Film) Laminating is a Hot Bar bonding technique to make electrical bonds between flexible and rigid circuit boards, glass panel displays and flex foils
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/news/nordson-dima-at-smt-hybrid-2018
. A third demonstrated hot bar product will be the C-Tack Desktop System, which is especially designed for ACF laminating in pre-tacking or pre-bond applications
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