New SMT Equipment: acf bonding (Page 1 of 2)

ACF Bonding

New Equipment | IC Packaging

Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations

Microjoin

Pulsed Heat HBR/HSC/ACF Bonding System

Pulsed Heat HBR/HSC/ACF Bonding System

New Equipment | Soldering Robots

Pulsed Heat HBR/HSC/ACF Bonding System SYSTEM SPECIFICATIONS Dimensions (Without signal tower) 750 mm x 760 mm x 558 mm Weight (Not including the CCD and LCD monitor) 88 Kg

Plastlist Group

TG-1000-24 Hotbar ACF Bonding or Soldering System with Motorized Rotary Table

New Equipment | Other

Toddco3 Hotbar Bonding or Soldering System is a modular, floor standing bonder with a precision servo-driven rotary table. Compact overhead controls system with touch-screen display for easy operator acess is standard. Standard system software provid

Toddco3

Pulsed Heat HBR/HSC/ACF Bonding System

Pulsed Heat HBR/HSC/ACF Bonding System

New Equipment | Soldering Robots

Pulsed Heat HBR/HSC/ACF Bonding System Model No.:  HB213/203 Features: Realtime temperature and force profile display on the LCD touch screen. Titanium alloy thermode ensure uniform temperature distribution, fast heating and longest service lif

Plastlist Group

C-Tack - ACF Laminating (Pre-tack) Desktop System

C-Tack - ACF Laminating (Pre-tack) Desktop System

New Equipment | Other

C-Tack Desktop System for ACF Laminating, also called Pre-Tacking or Pre-Bonding.  The C-Tack Desktop System was developed by Nordson DIMA for ACF Laminating (Pre-Tacking) applications. It uses pneumatic bonding head technology and offers reliable p

C-Tech Systems, B.V. [formerly Nordson DIMA]

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3

C-Quence - Automated in-line Bonding and Soldering Solutions

C-Quence - Automated in-line Bonding and Soldering Solutions

New Equipment | Soldering Robots

With the C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications.  With Nordson DIMA's automated and integrated C-Quence™

C-Tech Systems, B.V. [formerly Nordson DIMA]

High Force ACF Bonder

High Force ACF Bonder

New Equipment | IC Packaging

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha

Finetech

C-Slide - Bonding and Soldering Desktop System

C-Slide - Bonding and Soldering Desktop System

New Equipment | Soldering Robots

C-Slide Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with a fixture size up to 250 x 250 mm. The Nordson DIMA Desk

C-Tech Systems, B.V. [formerly Nordson DIMA]

C-Turn - Bonding and Soldering Desktop System

C-Turn - Bonding and Soldering Desktop System

New Equipment | Soldering Robots

C-Turn Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm. The Nordson DIMA Desktop Series is a p

C-Tech Systems, B.V. [formerly Nordson DIMA]

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