Electronics Forum | Wed Dec 10 14:37:47 EST 1997 | Frank Murch
There is a direct relationship between adhesive strength and surface area. If you graph this it will be linear. The amount of the adhesive should be about 2/3 the gap between the pads. Pad designs change all over so a true and tried rule does not ex
Electronics Forum | Wed Dec 10 11:11:04 EST 1997 | Rich Scheleski
Is there a spec for the adhesives used to hold down parts before wave soldering. What size dots are recommended and what is the maximum shear force(1LB?) tested for to ensure good adhesion. Your help is appreciated Rich Scheleski
Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Tue May 12 07:26:16 EDT 2009 | emmanueldavid
Jorge, The basic thumb rule to measure Adhesive Strength remains as bonded Chips at Post Reflow should not move around or misplace when Your Thumb Finger try to do so which called as Thumb Force Test. However as Dave stated, there are various Stre
Electronics Forum | Mon May 11 12:15:46 EDT 2009 | jorge_quijano
Hi, I just want to know how to measure the strength of a 0603 after it's cured, we are using Heraeus PD944 with a 30-7 mils stencil, glue depositions looks well, but I don't know how to measure it? Thanks
Electronics Forum | Mon May 11 16:23:08 EDT 2009 | jorge_quijano
Yes, this is for a double sided board, (bottom) the issue is that the board has a lot af hand ion components before wave soldering, and some components are falling off within this process, even if I hit the 0603s with my finger It falls.
Electronics Forum | Mon May 11 22:47:45 EDT 2009 | davef
We'd expect that a 0603 in properly cured, in-date code, properly dispensed chip bonder would take 5-8 pounds to push off the board.
Electronics Forum | Fri May 15 09:41:58 EDT 2009 | cyber_wolf
Use loctite chipbonder and forget about all this pull testing. I know that Loctite works good because it pulls a chunk of solder mask off the board when you push a part off.
Electronics Forum | Mon May 11 12:50:55 EDT 2009 | stepheniii
What is the purpose of glueing it? If it is glue the bottom side parts followed by reflowing the top side parts followed by wave soldering the bottom side parts, then it's easy to measure. Hold the board with the 0603s facing down. If they don't f
Electronics Forum | Fri May 15 08:04:32 EDT 2009 | rwyman
higher temp/shorter time). Solder mask may be a factor as well. I've seen parts get knocked off where the glue is still affixed to the part, along with a nice piece of solder mask from the board. If you can knock a part off with casual contact, th
