New Equipment | Solder Materials
Epibond® 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond®are high-quality non-slumping and non-stringing surface mount
Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st
Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef
You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a
Electronics Forum | Wed Sep 05 10:36:47 EDT 2007 | dwanzek
Hope you found an adhesive that works for you Dback. Thought I felt sharp pain in my back for awhile as did not follow up on this string. Then again, a response may prolong the pain, oh well figured a need for accurate information. FYI for RealHuss
Industry News | 2015-07-21 08:21:52.0
Engineered Materials Systems introduced its new EMS 561-403 Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.
Industry News | 2016-08-08 20:27:23.0
Engineered Materials Systems is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Two-Part-Mixing-Pump.pdf
• Encapsulant and potting fluids • Gasketing, dot, or bead applications • Suitable for 2-component adhesive systems based on: epoxy resin (EP), polyurethane (PU), silicone (Si), methyl methacrylate
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