Industry Directory: advanced interconnections (29)

Advanced Interconnects Marketing

Industry Directory | Manufacturer's Representative

Sales Reprentatives for RF and Microwave connectors and cable assemblies.

Advanced Interconnection Technology

Industry Directory |

AIT is a leading manufacturer of advanced two and three dimensional circuit boards using the techniques of copper plated ceramic and three dimensional moulded circuitry

New SMT Equipment: advanced interconnections (438)

IPC Advance Design Certification

IPC Advance Design Certification

New Equipment | Education/Training

Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or CID+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider t

EPTAC Corporation

​Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter

​Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter

New Equipment | Pick & Place

​Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te

Dongguan Intercontinental Technology Co., Ltd.

Electronics Forum: advanced interconnections (17)

Re: Micro BGA Sockets...

Electronics Forum | Fri Sep 18 07:16:18 EDT 1998 | Wayne Bracy

Steve: You might want to contact Advanced Interconnects I know they manufacture standard BGA fixtures, but not sure about micro BGA. Advanced Interconnects, Inc. West Warwick, RI (401) 823-5200 (401) 823-8723 Fax Howard Gonzales You could also call T

Re: Welcome!

Electronics Forum | Thu Aug 27 21:52:15 EDT 1998 | Dan

| Thank you for visiting the new Admin Corner. Please feel free to comment on any parts and aspects of the SMTnet site. We will be inviting your opinions on various issues very soon. Cunli If I have forgotten my password, do I have to re-register o

Used SMT Equipment: advanced interconnections (7)

Tektronix DSA8200 Digital Serial Analyzer Sampling Oscilloscope

Tektronix DSA8200 Digital Serial Analyzer Sampling Oscilloscope

Used SMT Equipment | General Purpose Test & Measurement

30 dB of Loss Linear Filter for Fixture De-embedding, Linear Filtering TDR (Time Domain Reflectometry) Up to 50 GHz TDR Bandwidth with 15 ps Rejected Rise Time and 12 ps Incident Rise Time Lowest Noise for Accurate Repeatable TDR Measurement Res

Shenzhen Zhongce Photoelectric Technology Co., LTD

Tektronix TDS7404

Tektronix TDS7404

Used SMT Equipment | In-Circuit Testers

Oscilloscope 4GHz, 4 Channel, DPO TDS7000 Series Digital Phosphor Oscilloscopes are high performance solutions for verification, debug and characterization of sophisticated electronic designs. The family features exceptional signal acquisition perfor

Test Equipment Connection

Industry News: advanced interconnections (458)

Nextek Expands Production Operations

Industry News | 2003-06-25 12:49:17.0

Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies

SMTnet

DDi Corp To Move From Nasdaq Small Cap Market To Over The Counter Bulletin Board

Industry News | 2003-04-14 09:02:03.0

The stock will be eligible to trade on the Over the Counter Bulletin Board (OTCBB) under the ticker symbol �DDIC� as early as April 15, 2003, provided a market maker enters a quote for the security.

SMTnet

Technical Library: advanced interconnections (12)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Advanced Packaging Technology

Technical Library | 2019-10-16 10:20:25.0

A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.

ACI Technologies, Inc.

Videos: advanced interconnections (8)

Electronics in Harsh Environments Conference 2019 Summary

Electronics in Harsh Environments Conference 2019 Summary

Videos

Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh

Surface Mount Technology Association (SMTA)

?Yamaha S10 SMD Placement

Videos

​Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: advanced interconnections (14)

IPC Advanced Designer Certification (CID+) Training Course

Training Courses | | | IPC Designer Certification CID+

The CID+ is the advanced version of the Certified IPC Interconnect Designer (CID) program targeted toward those working in the PCB design industry.

EPTAC Corporation

IPC Advanced Designer Certification (CID+) Training Course

Training Courses | | | IPC Designer Certification CID+

The CID+ is the advanced version of the Certified IPC Interconnect Designer (CID) program targeted toward those working in the PCB design industry.

EPTAC Corporation

Events Calendar: advanced interconnections (12)

Reliable Electronics for the Automotive Industry Technical Workshop

Events Calendar | Sat Jul 06 00:00:00 EDT 2019 - Sat Jul 06 00:00:00 EDT 2019 | Chennai, India

Reliable Electronics for the Automotive Industry Technical Workshop

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference

Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference

Surface Mount Technology Association (SMTA)

Career Center - Jobs: advanced interconnections (1)

Quality Manager

Career Center | Milpitas, California USA | Quality Control

Winslow Automation, Inc. (aka Six Sigma), an industry leader in microelectronic component packaging interconnect technology and related analytical testing & failure analysis services, is seeking a multi-tasking, detail-oriented, customer-centric qual

Winslow Automation (aka Six Sigma)

Career Center - Resumes: advanced interconnections (3)

Thomas Carney Resume

Career Center | Manchester, Massachusetts USA | Sales/Marketing

Technicals Sales - Account Management - Strategic Planning - Skills Development - International Sales - Presentation Skills - Salesforce.com - Microsoft Proficient.

Sales

Career Center | Chennai, India | Sales/Marketing

Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali

Express Newsletter: advanced interconnections (984)

SMTnet Express February 14 - 2013, Subscribers: 26181

SMTnet Express February 14, 2013, Subscribers: 26181, Members: Companies: 13288, Users: 34310 Boundary Scan Advanced Diagnostic Methods Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts by: Dave Becker; All Flex Flexible Circuits Flexible Circuits are proven, reliable interconnect

Partner Websites: advanced interconnections (55)

Semiconductor

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor

& Product Lines ADVANCED TECHNOLOGY SOLUTIONS ● Nordson ELECTRONICS SOLUTIONS     ◦ ASYMTEK Products     ◦ MARCH Products     ◦ SELECT Products ● Nordson TEST & INSPECTION     ◦ ACOUSTIC Products     ◦ OPTICAL Products     ◦ TEST Products     ◦ Manual X-ray Products

ASYMTEK Products | Nordson Electronics Solutions

IPC J-STD-001H: Requirement for Soldered Electrical and Electronic Assemblies

| https://store.aciusa.org/IPC-J-STD-001H-Requirement-for-Soldered-Electrical-and-Electronic-Assemblies-P128.aspx

IPC J-STD-001H: Requirement for Soldered Electrical and Electronic Assemblies Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home  >  Publications


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