Industry Directory | Manufacturer's Representative
Sales Reprentatives for RF and Microwave connectors and cable assemblies.
AIT is a leading manufacturer of advanced two and three dimensional circuit boards using the techniques of copper plated ceramic and three dimensional moulded circuitry
New Equipment | Education/Training
Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or CID+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider t
Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te
Electronics Forum | Fri Sep 18 07:16:18 EDT 1998 | Wayne Bracy
Steve: You might want to contact Advanced Interconnects I know they manufacture standard BGA fixtures, but not sure about micro BGA. Advanced Interconnects, Inc. West Warwick, RI (401) 823-5200 (401) 823-8723 Fax Howard Gonzales You could also call T
Electronics Forum | Thu Aug 27 21:52:15 EDT 1998 | Dan
| Thank you for visiting the new Admin Corner. Please feel free to comment on any parts and aspects of the SMTnet site. We will be inviting your opinions on various issues very soon. Cunli If I have forgotten my password, do I have to re-register o
Used SMT Equipment | General Purpose Test & Measurement
30 dB of Loss Linear Filter for Fixture De-embedding, Linear Filtering TDR (Time Domain Reflectometry) Up to 50 GHz TDR Bandwidth with 15 ps Rejected Rise Time and 12 ps Incident Rise Time Lowest Noise for Accurate Repeatable TDR Measurement Res
Used SMT Equipment | In-Circuit Testers
Oscilloscope 4GHz, 4 Channel, DPO TDS7000 Series Digital Phosphor Oscilloscopes are high performance solutions for verification, debug and characterization of sophisticated electronic designs. The family features exceptional signal acquisition perfor
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Industry News | 2003-04-14 09:02:03.0
The stock will be eligible to trade on the Over the Counter Bulletin Board (OTCBB) under the ticker symbol �DDIC� as early as April 15, 2003, provided a market maker enters a quote for the security.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te
Training Courses | | | IPC Designer Certification CID+
The CID+ is the advanced version of the Certified IPC Interconnect Designer (CID) program targeted toward those working in the PCB design industry.
Training Courses | | | IPC Designer Certification CID+
The CID+ is the advanced version of the Certified IPC Interconnect Designer (CID) program targeted toward those working in the PCB design industry.
Events Calendar | Sat Jul 06 00:00:00 EDT 2019 - Sat Jul 06 00:00:00 EDT 2019 | Chennai, India
Reliable Electronics for the Automotive Industry Technical Workshop
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Milpitas, California USA | Quality Control
Winslow Automation, Inc. (aka Six Sigma), an industry leader in microelectronic component packaging interconnect technology and related analytical testing & failure analysis services, is seeking a multi-tasking, detail-oriented, customer-centric qual
Career Center | Manchester, Massachusetts USA | Sales/Marketing
Technicals Sales - Account Management - Strategic Planning - Skills Development - International Sales - Presentation Skills - Salesforce.com - Microsoft Proficient.
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
SMTnet Express February 14, 2013, Subscribers: 26181, Members: Companies: 13288, Users: 34310 Boundary Scan Advanced Diagnostic Methods Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC
Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts by: Dave Becker; All Flex Flexible Circuits Flexible Circuits are proven, reliable interconnect
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
& Product Lines ADVANCED TECHNOLOGY SOLUTIONS ● Nordson ELECTRONICS SOLUTIONS ◦ ASYMTEK Products ◦ MARCH Products ◦ SELECT Products ● Nordson TEST & INSPECTION ◦ ACOUSTIC Products ◦ OPTICAL Products ◦ TEST Products ◦ Manual X-ray Products
