Technical Library | 2015-09-17 17:36:56.0
RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. In the years which have followed the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards.
Technical Library | 2018-03-05 11:22:48.0
Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.
Technical Library | 2018-11-07 20:48:01.0
Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications. We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously.
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