BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Details Images Features * High-speed placements of up to 100,000 CPH. * Best-in-class placement rate per square meter(sq ft). * Integrates seamlessly with the production enviroment * Trace Monitor tracks quality throughout production process * Lo
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