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Sector Specification(CM202-DS) Specification(CM201-DS) ModelNo. KXF-E24C KXF-E14C TactTime 0.088sec/chip 0.176sec/chip B'd change: 3.0 sec Centering method: Upward Vision PCB Size(L x
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Refurbished NXT-III 2xM3III (2 x H24S Head) FUJI SMT Pick and Place Machine Specification of FUJI AIMEX III SMT SMD Pick and Place Machine MC Model M3 III M6 III Applicable PCB size (LxW) 48 x 48 mm to 250 x 510 mm (dou
Electronics Forum | Sat Dec 11 10:45:08 EST 1999 | tom terlizzi
tried again to dec 11 and it work the first time I don't have my password this time I did so maybe you have to been in a password mode thanks Tom Terlizzi aeroflex
Electronics Forum | Tue Aug 28 09:53:44 EDT 2001 | Brock
Stefan, I could be wrong but I have a question about every 10th board having a defect. If a machine places 1 million components and a the board has 200 components you arrive at 5000 boards. If every 10th board has a defect, then only 500 boards have
Used SMT Equipment | Chipshooters / Chip Mounters
Model :KE-760 Placement speed：Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg jenny@ksunsmt.com
Used SMT Equipment | Pick and Place/Feeders
Model :KE-760 Pick and Place Machine Placement speed：Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg Currently, all the mac
Industry News | 2003-02-27 08:41:52.0
Elec & Eltek International Co. Ltd. (
Industry News | 2023-05-15 17:38:25.0
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.
Parts & Supplies | Assembly Accessories
DCPH0630;DCPH3780 CP8 filter and base DCPH3820 DCPH0630 CP7 filter and base H1194D nozzle FUJI XP243 AGFPN8540 nozzle FUJI XP243 H1340A nozzle FUJI XP243 AGFPN8530 nozzle FUJI XP243 H1194C nozzle FUJI XP2
Parts & Supplies | SMT Equipment
QUALITY OEM MIRAE AND I PULSE SMT NOZZLES Full series are available,few are listed below: Machine Mirae Machine Mirae MX-310,MX-240,MX-110,MPS-1010,MPS-1020,MPS-1025 P/N: A (1005) Des: Nozzle,ø0.65/ø0.38 P/N: A+B (1005~1608) Des: No
Technical Library | 2017-08-10 01:23:22.0
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.
Technical Library | 2017-09-14 01:21:52.0
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.
FUJI SMT Pick and Place Machine NXT III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine,
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Mar 02 00:00:00 EST 2020 - Thu Mar 05 00:00:00 EST 2020 | Fountain Hills, Arizona USA
16th International Conference and Exhibition on DEVICE PACKAGING
International Microelectronics Assembly and Packaging Society (IMAPS)
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