Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2020-09-02 14:34:23.0
Atomic layer deposition (ALD) is a process of creating coatings on a molecular layer by layer basis. Using an iterated sequence of self-saturating deposition cycles that are self-terminating, a single layer can be deposited at a time, allowing for highly uniform films with complete conformality. The composition of the film typically used for coating printed wiring boards (PWBs) is a high alumina (Al2O3) sequential deposition of alumina and titania capped with a corrosion protective titanium aluminate layer, most notably ALD-Cap from Sundew Technologies, LLC. Rework is a process of restoring an electronics assembly to full functionality to prolong equipment life and reduce the amount of scrap. The process typically involves:
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2011-05-26 19:26:12.0
The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde
Technical Library | 2006-11-14 12:48:31.0
Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package
Technical Library | 2013-01-30 14:02:44.0
Many OEM’s require that individual wires and cables used in their products be clearly identified with a mark or label. For some, such as in the military and aerospace markets, wire and cable identification (or “wire ID”) is mandatory and the process is governed by stringent specifications, such as SAE AS50881 (formerly MIL5088L). For others, the decision to use wire ID is a voluntary one. This article will describe what type of information is typically identified on wire and cables, concepts for improved productivity, what types of systems are available and the pros and cons of each.
Technical Library | 2018-09-12 21:04:28.0
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This paper will provide a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the Aerospace and Defense sector. An analysis of industry information on the types and nature of counterfeit components will be discussed in order to illustrate those most likely to be counterfeited, followed a specific case at a major defense contractor.
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).