technical parameter Model: s1200 (special type for LED light bar) Overall dimension (L × w × h): 1650 × 620 × 1550 (mm) Platform size: 320 × 1300 (mm) PCB size: 250 × 1250 (mm) Applicable template size: 550 ×
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New Equipment | Component Programming
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Electronics Forum | Fri Aug 06 05:04:45 EDT 2021 | oxygensmd
Hello Everyone, I am looking for manual for the following equipments: Asys MPS 50D (mag buffer), Asys TDM 03 (telescoping conveyor), Asys AES01 (1mag loader), Asys LSB 03 (stacker). I hope you can help.
Electronics Forum | Fri Apr 01 18:32:51 EDT 2011 | frcdave
Dback, Some questions for you: 1. Are you using the red light configuration for better contrast on the 0402 parts? 2. Is your system fitted with both low and High Magnification cameras? Have you spoken with the guys at YESTech? Their phone support i
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-002-003-E1963A-403-E1963A-413-E1968A-410-E1987A-E 1991B
Used SMT Equipment | In-Circuit Testers
123 dB dynamic range at test port (typical) Fast measurement speed: 39 ms @ full 2-port cal, 1601 points Low trace noise: 0.004 dB rms @ 70 kHz IFBW Integrated 2- and 4-ports with balanced measurements Frequency options are available: From 9 kHz/
Industry News | 2013-01-21 11:15:30.0
MIRTEC, announces the opening of a new manufacturing facility in Europe to further strengthen business and local support.
Industry News | 2010-03-05 10:01:36.0
The latest developments in SMT Nozzles and Consumables, New Website, $1000 Sweepstakes, Free Nozzles, and more! Stop by booth #1870!
Parts & Supplies | SMT Equipment
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Parts & Supplies | Pick and Place/Feeders
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Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
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Career Center | Fort Walton Beach, Florida USA | Engineering
Are you passionate about Test Engineering? Do you have an Electrical background? The Electronics Group of Crane Aerospace & Electronics designs and manufactures high-density, high-reliability electronics for our aerospace, space, military, me
