SHENZHEN MOYA LED LIGHTING CO.,LTD as a professional LED lighting manufacturer locate in Shenzhen,china .Now our products cover LED Spotlights,bulbs,downlights,tubes and panel lamps .and hard work .
Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Wed Aug 07 08:49:35 EDT 2002 | davef
What do you want to be certified? So, do you have a specification control drawing for each component that defines your expected performance capabilities for use by your buyer in acquiring these parts? If there is a reason to fabricate parts to your
AOI Featuring Vectoral Imaging! An AOI solution at any location in a smt line. 0201 ready! The Vi-3K is the high performance AOI system that determines the presence and absence of components, confirms their value and polarity, and ensures placement
Ultra popular machine (not an i style) in excellent condition with feeders available. 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads) 01005 (0402) - 45 mm sq. (1.
Industry News | 2012-09-04 09:33:37.0
Europlacer North America announces that it has successfully installed an IINEO-II, capable of handling 24 wide x 27" long boards, at New Age EMS of Attleboro, MA. The IINEO-II platform features 264 8 mm feeder slots and has a maximum placement rate of 27,300 cph.
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Lead Cutting Machine - Capacitor Cutter 301 Specifications This lead forming machine is used to lead-cutting and forming of taped resistors, diodes, and other axial components. FEATHERS 1. It is used to cut radial leads of bulk radial
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2012-11-21 18:57:58.0
The continuing evolution toward advanced miniature packaging has led to ever increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is an ever increasing probability for defects to occur on finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship on electronic assemblies. While advancements in conventional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper component orientation, insufficient solder, and solder bridges; there is an inherent limitation in the ability to inspect for co-planarity of ultra-miniature chips, leaded device, BGA and LED packages.
FOR SALE: Assembleon / Yamaha Opal XII smt pick and place pcb assembly machine running production. This machine is available fully functional from the Capital Equipment Exchange. http://www.ce-exchange.com/detail/assembleon-opal-xii-flex-placer-48
For Sale: Used ERSA VersaFlow 40/50 dual module selective soldering machine. Best in class for speed, flexibility, and reliability. Available for live or video demonstration at the Capital Equipment Exchange. details at... http://www.ce-exchange.c
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick
SMTnet Express, April 18, 2019, Subscribers: 31,856, Companies: 10,750, Users: 26,011 Reliability of ENEPIG by Sequential Thermal Cycling and Aging Credits: Jet Propulsion Laboratory ENEPIG surface finish for PCB has now become a key surface
*Michael Konrad, Aqueous Technologies Milo Reexamination of Thermal Cycling Reliability of BGA Components with SnAgCu and SnPb Solder Joints on Different Board Designs *John Evans, Ph.D
. We are proud to provide the vital and basic components for DCT to create its LLINs and happy to see them in use here in Managua and everywhere people are affected", comments Francis Baud, Clariant's